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Denmark – Industrial machinery – Delivery and installation of a ICP Reactive ion etcher for silicon dielctrics

Issued by Danmarks Tekniske Universitet - DTU · via TED — Tenders Electronic Daily (EU)

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Published
12 Oct 2026
Closes
23 Nov 2026, 23:59 UTC
Reference
701524-2026
Location
Denmark
Sector
Manufacturing & Supply
Type
goods

This notice was amended

Details changed after publication. Re-check the official notice before bidding.

  • Submission deadline changed from 23 Nov 2026, 22:55 UTC to 23 Nov 2026, 23:59 UTC
    First seen by FreeTender on 12 Oct 2026 — most portals don’t publish when a corrigendum was issued.

At a glance

Danmarks Tekniske Universitet - DTU in Denmark has published an invitation to bid in manufacturing & supply: “Denmark – Industrial machinery – Delivery and installation of a ICP Reactive ion etcher for silicon dielctrics”. Submissions close on 23 November 2026, 43 days from today. Quote reference 701524-2026 in any correspondence with the buyer. 2 documents are attached to this notice. FreeTender has recorded 28 notices from this buyer since 2024, 25 of them currently open. There are 71 open manufacturing & supply notices in Denmark on FreeTender. Bids are submitted to the buyer through TED — Tenders Electronic Daily (EU), not through FreeTender.

Details

DTU Nanolab wishes to acquire a high ion density source reactive ion etcher for oxides and nitrides of silicon to become its new primary instrument for 150 mm wafer processing. Delivery is expected no later than Q3 2027. The Instrument will be installed in the DTU Nanolab cleanroom - a university facility providing a comprehensive suite of micro- and nanofabrication tools. It serves a diverse community of over 200 active users, ranging from novice students to experienced researchers, as well a high percentage of commercial clients. As an open access tool, the Instrument must support the full spectrum of etching of silicon-based dielectrics, from sub 100 nm nanostructures defined by electron beam lithography to depths of several tens of microns. Meeting these demands requires exceptional process controllability and tunability: the system must perform ultra precise, low-rate etches (< 100 nm/min) with smooth and straight sidewalls and minimal undercut for shallow features, alongside high etch rate deep etches (approaching 500 nm/min). It must also accommodate all silicon dielectrics of the form SixNy, SixOx and SixOyNz, and be compatible with mask materials including Si, Cr, e-beam resists and UV/DUV photoresists with high mask selectivity for all these masking materials. The user interface must be intuitive and user friendly. The Instrument should be engineered to the highest industrial standards to minimize maintenance, and any required servicing must be straightforward and efficient. The instrument must be configured for 150 mm wafer processing and a complete kit enabling the processing of 200 mm wafers must be included in the tender as an option. Furthermore, DTU will have the option to purchase one more ICP Reactive ion etcher for silicon dielctrics identical to the initial instrument.

Lots Lot 1 — Delivery and installation of a ICP Reactive ion etcher for silicon dielctrics

Buyer: Danmarks Tekniske Universitet - DTU

Buyer country: DNK

Procedure: open

CPV code: 42000000

Full notice, tender documents and how to bid are on the official TED page (link above).

Context for bidders

We hold 28 notices from Danmarks Tekniske Universitet - DTU, going back to January 2024 — 25 of them still open. They buy mostly in Manufacturing & Supply, Transport & Logistics and Financial & Professional Services. There are 71 open Manufacturing & Supply tenders in Denmark. This one closes in 43 days.

Documents

Before you bid on this tender

A quick checklist to help you decide whether to bid and prepare a compliant submission for this manufacturing & supply opportunity. Always verify the details on the official source.

  • Confirm the exact closing date and time (and time zone) on the official portal — deadlines are strict and can be revised by a corrigendum.
  • Read the full notice and every attached document, including the scope, specifications and any bill of quantities or terms of reference.
  • Check the eligibility criteria — prior similar experience, annual turnover, certifications and registrations — and make sure you qualify before investing effort.
  • Prepare any earnest-money deposit (EMD) or bid security and the required formats early; missing or wrongly-formatted documents are a common cause of rejection.
  • Note how bids must be submitted (online or physical), in what format, and whether a digital signature or portal registration is required.
  • Watch for corrigenda and clarifications right up to the deadline — requirements and dates can change.
Common bidding mistakes to avoid →Writing a winning proposal

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