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Automated 300 mm Die-to-Wafer thermocompression bonding tool - PR1275392-3460-W

Automated 300 mm Die-to-Wafer thermocompression bonding tool - PR1275392-3460-WEnglish, machine translated

Issued by Fraunhofer-Gesellschaft, Einkauf B12 · via Bekanntmachungsservice — Germany (federal notices)

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Published
1 Nov 2026
Closes
2 Dec 2026, 10:00 UTC
Reference
PR1275392-3460-W
Location
Dresden, DED21, Germany
Sector
Electronics semiconductors
Type
goods

At a glance

Fraunhofer-Gesellschaft, Einkauf B12 in Dresden, Germany has published a tender in electronics semiconductors: “Automated 300 mm Die-to-Wafer thermocompression bonding tool - PR1275392-3460-W”. Submissions close on 2 December 2026, 31 days from today. Quote reference PR1275392-3460-W in any correspondence with the buyer. FreeTender has recorded 47 notices from this buyer since 2026, 22 of them currently open. There are 8 open electronics semiconductors notices in Germany on FreeTender. Bids are submitted to the buyer through Bekanntmachungsservice — Germany (federal notices), not through FreeTender.

English summary

Machine translated from German by FreeTender. The original notice below is the binding text.

Contracting authority: Fraunhofer-Gesellschaft, Purchasing B12. Lot: LOT-0000. CPV code: 31712000. Place of performance: Dresden, DED21. Published: 01 November 2026. Deadline for receipt of tenders: 02 December 2026 11:00. Published on the German federal notice service (announcement service, oeffentlichevergabe.de); the full notice and documents are on the source page.

Details

Automated 300 mm Die-to-Wafer thermocompression bonding tool - PR1275392-3460-W

Contracting authority: Fraunhofer-Gesellschaft, Einkauf B12.

Lot: LOT-0000.

CPV code: 31712000.

Place of performance: Dresden, DED21.

Published: 01 November 2026.

Deadline for receipt of tenders: 02 December 2026 11:00.

Published on the German federal notice service (Bekanntmachungsservice, oeffentlichevergabe.de); the full notice and documents are on the source page.

Context for bidders

We hold 47 notices from Fraunhofer-Gesellschaft, Einkauf B12, going back to August 2026 — 22 of them still open. They buy mostly in Manufacturing & Supply, Energy & Power and Construction & Infrastructure. There are 8 open Electronics semiconductors tenders in Germany. This one closes in 31 days.

Before you bid on this tender

A quick checklist to help you decide whether to bid and prepare a compliant submission for this electronics semiconductors opportunity. Always verify the details on the official source.

  • Confirm the exact closing date and time (and time zone) on the official portal — deadlines are strict and can be revised by a corrigendum.
  • Read the full notice and every attached document, including the scope, specifications and any bill of quantities or terms of reference.
  • Check the eligibility criteria — prior similar experience, annual turnover, certifications and registrations — and make sure you qualify before investing effort.
  • Prepare any earnest-money deposit (EMD) or bid security and the required formats early; missing or wrongly-formatted documents are a common cause of rejection.
  • Note how bids must be submitted (online or physical), in what format, and whether a digital signature or portal registration is required.
  • Watch for corrigenda and clarifications right up to the deadline — requirements and dates can change.
Common bidding mistakes to avoid →Writing a winning proposal

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