Supply, Delivery and Installation of Wafer-Level Optical Tester
University of Strathclyde
- Published
- 5/8/2026
- Closes
- 7/9/2026, 4:30:00 pm
- Bid opening
- —
- Value
- GBP 7,88,000
- Reference
- UOS-43643-2026
- Location
- United Kingdom
- Sector
- Manufacturing & Supply
- Type
- goods
Details
Background
The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for wafer-level optical tester(s) capable of performing characterization of both surface-emitting Distributed Feedback (DFB) laser arrays and silicon photonic integrated circuits (PICs).
Before you bid on this tender
A quick checklist to help you decide whether to bid and prepare a compliant submission for this manufacturing & supply opportunity. Always verify the details on the official source.
- Confirm the exact closing date and time (and time zone) on the official portal — deadlines are strict and can be revised by a corrigendum.
- Read the full notice and every attached document, including the scope, specifications and any bill of quantities or terms of reference.
- Check the eligibility criteria — prior similar experience, annual turnover, certifications and registrations — and make sure you qualify before investing effort.
- Prepare any earnest-money deposit (EMD) or bid security and the required formats early; missing or wrongly-formatted documents are a common cause of rejection.
- Note how bids must be submitted (online or physical), in what format, and whether a digital signature or portal registration is required.
- Watch for corrigenda and clarifications right up to the deadline — requirements and dates can change.
More Manufacturing & Supply tenders
- Miscellaneous Skilled and unskilled civil maintenance works at Sulphate plant in FACT- Fert. Udyogamandal.The Fertilisers And Chemicals Travancore Ltd. · Head Office - FACT · Corporate materials - FACT · India
- Replacement of Dual plate check valves of pump set nos. 02, 05, 06 at New Avantika Booster Pumping Station AC-06.
Reference: NIT No.08 /EE(EnM)M-8/2026-27 Item 15
Tender Type: Open Tender
Contract FoDelhi Jal Board · Delhi Jal Board · EE (E and M) M-8 · India
- ДК 021:2015 код 42510000-4 Теплообмінники, кондиціонери повітря, холодильне обладнання та фільтрувальні пристрої (Кондиціонери для філії «Дніпровська ГЕС» ПрАТ «Укргідроенерго»)Приватне акціонерне товариство "Укргідроенерго" · Ukraine
- Fabrication, Supply and Installation of wire mesh Mild Steel Security Barricades alongwith special repair of old existing security barricades at various locations in the Institute by the Security Department, PGIMER ChandigarhPostgraduate Institute of Medical and Education and Research Chandigarh · Engineering department - PGIMER Chandigarh · H.E.(Biomedical) - PGIMER Chandigarh · India
- Hiring of jetting cum-suction machine, having standard pump and water tank (1500 ltr) mounted on Mahendra Bolero for maintenance of sewerage system of ward No-235 in AC-67 Babarpur under EE(C )-5Delhi Jal Board · Delhi Jal Board · EE (Civil) - 5 · India
Ready to bid? Verify the details and apply on the official tender page.
Verify & apply on the official portal →