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Germany – Machines and apparatus for testing and measuring – Semi-Automatic Wafer Prober System for Characterization of 200-mm Wafers

Issued by IHP GmbH - Lebniz-Institut für innovative Mikroelektronik · via TED — Tenders Electronic Daily (EU)

Published
29 Sept 2026
Closes
29 Oct 2026, 23:59 UTC
Reference
670077-2026
Location
Germany
Sector
Manufacturing & Supply
Type
goods

Details

The subject of the procurement is the supply, installation and commissioning of a semi-automatic wafer prober system for the electrical and high-frequency characterization of 200-mm wafers for research and laboratory use at IHP. The system shall include, among other components, a 200-mm wafer prober with vacuum chuck and precision positioning, individual probes, multi-contact probes for RF measurements up to at least 6 GHz, a probe card system, automated microscopy and camera equipment, as well as control and software components. The scope of supply also includes transport, installation, commissioning, training, documentation, warranty and spare-parts supply.

Lots Lot 1 — Semi-Automatic Wafer Prober System for Characterization of 200-mm Wafers: Description of the Procurement - Type and Scope of Supplies / Requirements The procurement comprises the supply of a complete semi-automatic wafer prober system for the electrical and RF characterization of 200-mm wafers for research and laboratory applications at IHP. The scope of supply includes, in particular, a semi-automatic 200-mm wafer prober with vacuum chuck, precision XY/Z/Theta positioning, shielded prober chamber, six individual electrical probes, two multi-contact probe holders suitable for RF measurements up to at least 6 GHz, and a probe card adapter. The system shall also include an automated microscope, color and side-view cameras, control PC, hardware control panel, control software, required cables, interfaces, power supplies and replacement probes. The system shall support DC, pulsed I-V and low-frequency impedance measurements up to at least 10 MHz as well as RF characterization. All components shall be technically compatible and capable of being operated as an integrated system. The procurement further includes complete delivery, transport, installation, configuration, commissioning, functional testing, on-site training and provision of all required technical, operating and safety documentation. The supplier shall also provide warranty, service and spare-parts/consumables availability for the specified warranty period. The system must comply with the specified mechanical, electrical, safety, EMC, CE, IT and environmental requirements and be suitable for integration into the existing IHP laboratory and IT infrastructure.

Buyer: IHP GmbH - Lebniz-Institut für innovative Mikroelektronik

Buyer country: DEU

Procedure: open

CPV code: 38540000

Full notice, tender documents and how to bid are on the official TED page (link above).

Context for bidders

There are 576 open Manufacturing & Supply tenders in Germany. This one closes in 31 days.

Documents

Before you bid on this tender

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