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Accepting bidsitbGermany

Germany – Laboratory, optical and precision equipments (excl. glasses) – Flip Chip Die Bonder

Issued by FAIR - Facility for Antiproton and Ion Research in Europe GmbH · via TED — Tenders Electronic Daily (EU)

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Published
30 Aug 2026
Closes
22 Sept 2026, 23:59 UTC
Reference
582477-2026
Location
Germany
Sector
Manufacturing & Supply
Type
goods

Details

In flip-chip assembly, a semiconductor chip is electrically connected directly underside to a sensor via contact bumps. This requires a flip-chip die bonder, which places the chips flipped on the sensors with micrometer precision and enables various bonding technologies such as soldering, thermal bonding, and conductive adhesive bonding.

Lots Lot 1 — Flip Chip Die Bonder: The Flip-chip Die bonder should include the following process modules: - Precision die bonding (face up) - Flip chip bonding (face down) - adapted system work table - chip and substrate heating with process gas enclosure - software-controlled bonding force module - ultrasonic bonding module - in-situ-monitoring with video camera - form generator for creating reference elements for face up alignment - tool tip changing module - three different tool tips - tool tip support including heater - dispenser module for paste and liquids - UV-curing module - die-eject module

Buyer: FAIR - Facility for Antiproton and Ion Research in Europe GmbH

Buyer country: DEU

Procedure: open

CPV code: 38000000

Full notice, tender documents and how to bid are on the official TED page (link above).

Context for bidders

FAIR - Facility for Antiproton and Ion Research in Europe GmbH has 1 open notice on FreeTender. There are 65 open Manufacturing & Supply tenders in Germany. This one closes in 24 days.

Documents

Before you bid on this tender

A quick checklist to help you decide whether to bid and prepare a compliant submission for this manufacturing & supply opportunity. Always verify the details on the official source.

  • Confirm the exact closing date and time (and time zone) on the official portal — deadlines are strict and can be revised by a corrigendum.
  • Read the full notice and every attached document, including the scope, specifications and any bill of quantities or terms of reference.
  • Check the eligibility criteria — prior similar experience, annual turnover, certifications and registrations — and make sure you qualify before investing effort.
  • Prepare any earnest-money deposit (EMD) or bid security and the required formats early; missing or wrongly-formatted documents are a common cause of rejection.
  • Note how bids must be submitted (online or physical), in what format, and whether a digital signature or portal registration is required.
  • Watch for corrigenda and clarifications right up to the deadline — requirements and dates can change.
Common bidding mistakes to avoid →Writing a winning proposal

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